Isevisi yokwenza ngokwezifiso

Isevisi yokwenza ngokwezifiso i-Hardware

(1) Sekela ukwenziwa ngokwezifiso kwe-LCM;ithatha ingilazi yokuqala ye-A-gauge futhi yonke inqubo yokukhiqiza kusukela ekuhlanzeni nasekusikeni isepaki yokukhiqiza ye-DWIN.

(2) Sekela ukwenziwa ngokwezifiso kwephaneli yokuthinta, Amandla okugxambukela kwe-anti-electromagnetic kanye nokusebenza okuhle ngaphansi kwe-pulse yeqembu 4KV, kwenziwe ukuhlolwa kokugomela i-10v kanye ne-15KV yomoya emile.kanye nokwenza ngokwezifiso okusheshayo kocingo olulodwa olusheshayo, insimbi, ifilimu yepulasitiki.

(3) Sekela ukwenziwa ngokwezifiso kwe-PCBA (usayizi, umumo, ukujiya).

(4) Sekela ukwenziwa ngokwezifiso kwe-OCA bonding, ifilimu yohlangothi olulodwa (Inzwa eku-inthanethi engu-0.1mm).

(5) Sekela ukwenziwa ngokwezifiso kwengilazi yekhava, I-LOGO, umbala, ukwakheka, usayizi nokunye.

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Isevisi yokwenza isofthiwe ngokwezifiso

(1) I-UI interface, isekela ukuthuthukiswa okusheshayo kwekhasimende, isheshise inqubo yephrojekthi.

(2) Umsebenzi we-DGUS, uhlelo lokusebenza olwenziwe ngezifiso, umsebenzi othuthukisiwe othakazelisayo.

(3) Ipulatifomu yamafu, sekela ukuthuthukiswa kokwenziwa kwangasese.

(4) Ngokusebenzisa izinto zokusetshenziswa zomkhiqizo womugqa wokuqala, ikhwalithi iqinisekisiwe.

(5) Ubuchwepheshe obuthuthukisiwe, ukukhiqizwa okumaphakathi ochungechungeni lwezimboni, isivuno esikhulu, izindleko eziphansi.

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